Foxconn Interconnect Technology Limited ("FIT") focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the supply of precision components. FIT went public in 2017 on the Hong Kong Stock Exchange as FIT Hon Teng HKG:6088. Foxconn Optical Interconnect Technology ("FOIT") is a business unit under FIT responsible for commercial development and production of high speed fiber optic transceivers and solutions. FOIT was divested from the Avago Technologies Fiber Optic Products Division (FOPD) in December 2015. Headquartered in San Jose, CA, the FOIT organization has development teams in San Jose, CA, Breinigsville, PA and Singapore. FOIT is part of the FIT Communications and Infrastructure business segment.

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OptoelectronicsFiber Optics (278)Wire CableCable Assemblies (22)Development Boards, Kits, ProgrammersEvaluation and Demonstration Boards and Kits (1)
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